PLC touch screen control, one-botton automatic wax bonding process after manual loading
Compatible with 2 to 6 inch wafer, can be changed in the program.
Minimize the floor space in the clean room.
Item | TLB-360S |
Wafer size | 2 to 6 inch |
Loading Type | manual |
Wax dropping volume | Adjustable (wax time is controlled) |
Wax spinning rotation | 0-5000RPM |
Wax spinning control | 10 stages control at most |
Baking temperature | Max 350℃ |
Ceramic plate indexing system | Automatic rotation index |
Ceramic plate cooling system | Available |
Extruding wax | Silicone airbag pressing, pressure adjustable |
Pressing wafer | Cylinder pressing, pressure adjustable |
Control system | PLC+touch screen |