TSD

Technology and Services assist customers to Develop

Focus on Grinding, Polishing, CMP technology.

TSD

Work together to create the future of chips.

Committed to become the global leader in semiconductor equipment!

TSD

Based on Technological innovation

Responsibilities drive quality, Make equipment by heart, Support China's Chip Industry

Product center

  • GrindingGrinding

  • PolishingPolishing

  • CMPCMP

  • Bonding/Cleaning/BrushingBonding/Cleaning/Scrubbing

  • GrindingGrinding

  • PolishingPolishing

  • CMPCMP

  • Bonding/Cleaning/BrushingBonding/Cleaning/Scrubbing

Product application

Leading innovation, boosting intelligent manufacturing, TSD takes technological innovation as the driving force for sustainable development, insists on independent innovation oriented by customer needs, and provides equipment solutions with superior performance, high production efficiency and cost-effectiveness for customers and the market, brings unlimited possibilities to the industry.

Compound Semiconductor Substrate

TSD can provide grinding, lapping, polishing, waxing, cleaning machines and process solutions for various semiconductor substrate materials.

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Semiconductor Device

TSD can provide grinding, lapping, polishing, waxing machines and process solutions for various semiconductor devices.

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Advanced packaging

TSD can provide wafer grinding, CMP, post-CMP cleaning, EMC grinding, EMC flattening, EMC grooves machines and process solutions for advanced packaging process such as FlipChip, Bumping, TSV, SIP, etc..

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MEMS

TSD can provide CMP, post-CMP cleaning, grinding, polishing machines and process solutions for various MEMS wafers.

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About us

Beijing TSD Semiconductor Equipment Co., Ltd. takes the mission of "Technology and Services assist customers to Develop", focuses on R&D, production and sales of high-quality surface processing equipment in the semiconductor industry. With more flat, thinner and faster technology orientation, the company focuses on compound semiconductor substrate materials, semiconductor devices, advanced packaging, MEMS and other fields, provides systemic solutions and process equipment for grinding, polishing, and CMP.


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Beijing TSD Semiconductor Co., Ltd.

Add:No.1 Shunqiang Road, Shunyi District, Beijing China 101300

Email:sales@tsd-semicon.com

Phone:86-10-6477 8430

Fax:86-10-6477 8420

Beijing TSD Semiconductor Co., Ltd.
SUPPORT:YCXF

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