Product Center

Work together to create the future of the chips, committed to the continuous progress of grinding, polishing, and CMP technologies

Grinding

Polishing

CMP

Bonding/Cleaning/Brushing

Semiautomatic Single-axis Grinding Machine

Semiautomatic single-axis grinding machine is a high-precision grinding machine with simple operation, abundant function and high cost performance, is equipped with automatic thickness measurement and compensation system in manual loading, can grind wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications.

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Semiautomatic Double-axis Grinding Machine

Semiautomatic Double-axis Grinding Machine is a high-precision grinding machine which is equipped with two grinding wheel shafts, has the function of automatic thickness measurement and compensation system, manual loading, moving to fine grinding position after rough grinding, grinding wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications.

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Full Automatic Grinding Machine

The full automatic grinding machine is a high-precision grinding machine equipped with fully automatic loading and unloading system, uses wafer manipulator to pick up the wafers, has automatic centering, cleaning and drying functions. It can realize automatic grinding process from cassette to cassette, and keep wafers dry in and out.

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Horizontal Grinding Machine

The horizontal grinding machine is a small, high-precision grinding machine with high cost performance in manual loading, the grinding wheel shaft is installed in a horizontal way, the wafers are manually loaded, and the removal of grinding is controlled by grinding wheel feed. The operating table can be customized according to customer requirements and has a wide range of applications.

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