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Grinding
Polishing
CMP
Bonding/Cleaning/Brushing
POLI-400L is small size chemical mechanical polishing machine for 4&6 inch, which adopts manual loading method, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, are used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
POLI-500 is a small 8 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
POLI-762 is a small 12 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
86-10-6477 8430
