Put membrane back pressure on the wafer, polishing plate has built-in cooling system. Swing arm dresser, friction & temperature detection endpoint monitoring function and pressurization system on different areas is optional.
PC control system, touch screen control, semiautomatic loading pallet is optional, one-button automatic CMP polishing.
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4, 6, 8 & 12 inch polishing head, compatible with different sizes and types wafers.
Minimize the floor space of clean room.
|Specification / model||POLI-762|
|Wafer size||Max 12 inch|
|Polishing plate size||Ø762mm（30inch）|
|Polishing plate rotation||30~200 RPM|
|Polishing head rotation||30~200 RPM|
|Wafer pressure||70~350g/cm2 membrane airbag flexible pressure|
|Reciprocating dressing system||Swing dressing system can be upgraded|
|Friction & temperature monitoring system||Optional, EPD function can add|
|Semi-automatic loading pallet||Optional|
|Head pressurization on different area||Optional|
|Slurry supply system||Peristaltic pump,3 independent pipes|