Put membrane back pressure on the wafer, polishing plate has built-in cooling system, swing arm dresser and friction & temperature detection endpoint monitoring function is optional
PC control system, touch screen control, manual loading, one-button automatic CMP polishing.
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4 or 6 inch polishing head, compatible with different sizes and types wafers.
Minimize the floor space of clean room.
|Specification / model
|Max 6 inch
|Polishing plate size
|Polishing plate rotation
|Polishing head rotation
|70~500g/cm2 membrane airbag flexible pressure
|Reciprocating dressing system
|Swing dressing system can be upgraded
|Friction & temperature monitoring system
|Optional, EPD function can add
|Slurry supply system
|Peristaltic pump, 3 independent pipes