Product application

Focus ceaselessly, specialized in the industry deeply, assist semiconductor substrate materials, semiconductor devices, advanced packaging, and MEMS industries to flourish.

Compound Semiconductor Substrate

Semiconductor Device

Advanced packaging

MEMS

With abundant process experience in advanced packaging technology and machine process technology, TSD can provide wafer grinding, CMP, post-CMP cleaning, EMC grinding, EMC flattening, EMC grooves machines and process solutions for advanced packaging process such as FlipChip, Bumping, TSV, SIP, etc..

TSV

SIP

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