This series of polishing machines comprises high-precision single-sided polishing equipment with ceramic discs for the carrier used to polish while fixing wafers through wax pasting or wax-free adsorption. These machines can realize two-spindle and four-spindle processing at the same time and are easy to operate. They also feature strong compatibility, high stability, and good corrosion resistance. The polishing head cylinder can be actively rotated under pressure to achieve high speed and high pressure polishing. With different polishing pads and solutions, these machines are suitable for polishing various semiconductor materials.