This dual-spindle three-station fully-automatic grinder is suitable for grinding 6”/8” wafers; with high-precision spindle, the manipulator for loading and unloading, and integrating automatic alignment, transmission positioning, cleaning and drying functions, the equipment is able to realize the automatic operation of dry in and dry out. The equipment has the functions of automatic thickness measurement, multi-stage grinding, over-load waiting, etc., and the processing precision is high.