Solid Wax Bonder
TWB-1150/1360
This series comprises a desktop-type solid wax chip mounter with manual waxing and chip placement, air bag pressurization, and automatic pressing. These machines feature slide heating and cooling functions, resulting in uniform wax layers. The vacuum chamber is optional, enabling the creation of vacuums followed by hot pressing and cooling to produce better chip-mounting effects.
  • Maximum Wafer Size

    6 inch

  • Maximum Ceramic Plate Size

    OD150 mm

  • Mode Of Operation

    Manual

  • Features
    Pressurizing method
    The pressure value can be set, pressing plate is made of soft silicone film, the vacuum chuck table is to fix workpiece
    Control system
    Touch screen operation, the recipe can be stored and recalled
    Abundant configurations
    A chiller is equipped to improve wax bonding efficiency
    Good compatibility
    Suitable for 150/360mm ceramic block, quartz slides, etc.