Solid Wax Bonder
TWB-1150/1360
This series comprises a desktop-type solid wax chip mounter with manual waxing and chip placement, air bag pressurization, and automatic pressing. These machines feature slide heating and cooling functions, resulting in uniform wax layers. The vacuum chamber is optional, enabling the creation of vacuums followed by hot pressing and cooling to produce better chip-mounting effects.
Maximum Wafer Size6 inch
Maximum Ceramic Plate SizeOD150 mm
Mode Of OperationManual