Semi-Automatic Liquid Wax Bonder
TLB-360S/485S
This series comprises semi-automatic liquid wax chip mounters with manual loading and manual picking. These machines feature a placement and handling ceramic disc and complete wax dripping, wax spinning, baking, and mounting processes automatically. They adopt air bag pressing methods, resulting in outstanding wax-pasting effects with high precision. They are suitable for mounting before polishing various semiconductor substrate materials.
Wafer Size2-6 inch
Ceramic Plate SpecificationOD360 mm
Sheet Pressing DeviceAir bag + cylinder two-section pressure sheet