Semi-Automatic Liquid Wax Bonder
TLB-360S/485S
This series comprises semi-automatic liquid wax chip mounters with manual loading and manual picking. These machines feature a placement and handling ceramic disc and complete wax dripping, wax spinning, baking, and mounting processes automatically. They adopt air bag pressing methods, resulting in outstanding wax-pasting effects with high precision. They are suitable for mounting before polishing various semiconductor substrate materials.
  • Wafer Size

    2-6 inch

  • Ceramic Plate Specification

    OD360 mm

  • Sheet Pressing Device

    Air bag + cylinder two-section pressure sheet

  • Features
    Comprehensive functions
    Cylinder and airbag, two-stage pressing,high-precision wax bonding
    Wax bonding process
    Dripping – Spinning – Baking – Bonding – Pressurizing – Cooling
    Easy to operate
    Wax dripping, spinning, baking, and pressing
    Auxiliary equipment
    A chiller is equipped to improve wax bonding efficiency
    Good compatibility
    Suitable for 360/485mm ceramic block, two modes can be switched in the program