Fully-Automatic Liquid Wax Bonder
TLB-360F/485F/576F
This series comprises fully automatic liquid wax mounting machines that use manipulators for fully automatic loading. These machines are equipped with loading and unloading bins for fully-automatic handling and circulation of ceramic discs. They complete DIW cleaning, wax dripping, wax spinning, baking, and mounting processes for wafers, and adopt automatic air bag pressing for outstanding wax-pasting effects with high precision. They are suitable for fully-automatic mounting of various semiconductor substrate materials before polishing.
  • Wafer Size

    2-6 inch

  • Ceramic Plate Specification

    OD360 mm

  • Cleaning Station

    Pure water +PVA brush

  • Sheet Pressing Device

    Air bag + cylinder two-section pressure sheet

  • Features
    Comprehensive functions
    Cylinder and airbag, two-stage pressing, high-precision wax bonding
    Wax bonding process
    Dripping – Spinning – Baking – Bonding – Pressurizing – Cooling
    Automatic system
    Automatic wafer transportation by robot arm and automatic positioning
    Easy to operate
    Wax dripping, spinning, baking, and pressing
    Good compatibility
    Suitable for 360/485/576mm ceramic block, two modes can be switched in the program