Fully-Automatic Liquid Wax Bonder
TLB-360F/485F/576F
This series comprises fully automatic liquid wax mounting machines that use manipulators for fully automatic loading. These machines are equipped with loading and unloading bins for fully-automatic handling and circulation of ceramic discs. They complete DIW cleaning, wax dripping, wax spinning, baking, and mounting processes for wafers, and adopt automatic air bag pressing for outstanding wax-pasting effects with high precision. They are suitable for fully-automatic mounting of various semiconductor substrate materials before polishing.
Wafer Size2-6 inch
Ceramic Plate SpecificationOD360 mm
Cleaning StationPure water +PVA brush
Sheet Pressing DeviceAir bag + cylinder two-section pressure sheet