Double-Side Lapper
TDL-600/1200
This series of double-sided grinder comprises high-precision, high-stability grinding processing equipment with upper disc, lower disc, and inner ring active drives. The planetary wheel can be customized according to customer needs. With grinding discs for different materials and grinding solutions for different particle sizes and materials, these machines can realize double-sided grinding of various semiconductor materials.
  • Pressurized Mode

    Airbag

  • Grinding Pressure

    Max400 kgf

  • Upper&lower Plate Size

    OD630 mm

  • Star Wheel Specifications

    9B*5

  • Features
    Pressurizing method
    Airbag pressurization, proportional valve for accurate pressure control
    Processing method
    Double-side processing
    Process optimization
    Unique grinding plate surface shape precision control process