Diamond substrate Polisher
TGP-1040/1060/1540 series
This polishing machine is developed specially for diamond materials with single spindle and multiple stations. The polishing disc is characterized by high speed and swinging operations. The diamond substrate is fixed by vacuum adsorption and clamping. They can meet the requirements for high speed polishing of diamond materials.
  • Polishing plate Specifications

    OD400 mm

  • Amout of Polishing head

    4

  • Size of Polishing head

    2/4 inch

  • RPM Range of Polishing plate

    0-1500 RPM

  • Features
    Ultra High RPM
    Ultra high rotates speed makes higher removel rate
    Pressurizing Method
    Cylinders pressurization, proportional valve for accurate pressure control
    Drive Mode
    Polishing head rotates, polishing plate rotates and swings at meantime
    Constant temperature control
    Temperature control system for polishing plate / polishing head
    High Compatibility
    Maxium 6 inch