Diamond substrate Polisher
TGP-1040/1060/1540 series
This polishing machine is developed specially for diamond materials with single spindle and multiple stations. The polishing disc is characterized by high speed and swinging operations. The diamond substrate is fixed by vacuum adsorption and clamping. They can meet the requirements for high speed polishing of diamond materials.
Polishing plate SpecificationsOD400 mm
Amout of Polishing head4
Size of Polishing head2/4 inch
RPM Range of Polishing plate0-1500 RPM