Fully-Automatic Chemical Mechanical Polisher
TPC-2110
This is fully-automatic CMP polishing equipment suitable for thin film (dielectric layer) and used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. This machine is compatible with 6/8” wafers, adopts a multi-zone airbag pressurization mode, and can achieve nanoscale precision removal. It also has double-sided scrubbing, mega-sonic cleaning, spin drying & N2 blow drying functions, and can realize fully-automatic dry-in and dry-out CMP processing. EPD functions such as friction, eddy current, and online infrared detection are optional.
  • Wafer Size

    6/8 inch

  • Number Of Plates

    1

  • Wafer Airbag Pressure

    0-700 g/cm²

  • Diameter of Plates

    OD530 mm

  • Features
    Pressurizing method
    Multi zone pressurization
    Drive mode
    Polishing head rotates and swings at meantime
    Constant temperature control
    Temperature control system for polishing plate
    Cleaning unit
    Double-sided PVA brush, automatic double-sided scrubbing and drying
    Good compatibility
    Compatible with 4/6/8-inch wafers
    Control system
    PC program
    Automatic system
    Automatic loading and unloading, dry in and dry out