Who is TSD

Who is TSD

TSD focuses on research and development, production, and sales of ultra-precision surface processing equipment in the field of semiconductors.

Beijing TSD Semiconductor Equipment Co., it is a national high-tech enterprise with independent intellectual property rights, focusing on R&D, production and sales of ultra-precision plane processing equipment in the semiconductor field. With the mission of "Leading the Progress of Semiconductor Technology, Assisting Customers to Develop ", we are committed to become a global leading technology manufacturer of semiconductor equipment.

What Can We Do

TSD is guided by flatter, thinner and more reliable technology, is deeply engaged in ultra-precision plane processing technology in semiconductor substrate material, wafer fabrication, semiconductor device, advanced packaging, MEMS, etc., forms the core technology advantage of leading technology, superior performance and stable process, and can provide system solutions and process equipment for thinning, polishing and CMP.

Polisher

CMP

Grinder

History

2024

B+ Round of Financing & In-depth Development

Won the title of“national specialized,unique and new small giant enterprise”&“Chinese (potential) unicorn enterprise”
Successfully launched 8” silicon carbide substrate grinding and polishing full-line equipment and 8” silicon carbide wafer grinder
Established the Langfang Branch
Completed B+ round of financing

2023

Series B Financing & Establishment of branch office

Won the Beijing special new small and medium-sized enterprise, Beijing intellectual property pilot unit,
Post-doctoral research workstation identification
Successfully released TFG series automatic grinder, TPC series automatic chemical mechanical polisher,
TSC series wafer scrubber and TGP series diamond polisher
Set up branchs in Wuxi, Shenzhen
Completed Series B financing

2022

Strategic financing & moving the Company to a new location

Strategic investment reached with Shenzhen Hubble and the first round of investment with Anxin and Hongtai
Successfully launched TDL and TDP series double-sided grinding and polishing equipment
Able to provide silicon carbide substrate grinding and polishing line equipment
Established the Langtour Laboratory and Excelsior Laboratory
Moved the Company to Scientific Entrepreneurship Chip Park No.1

2021

Increase R&D investment & develop the business rapidly

Awarded as a national high-tech enterprise
Successfully launched TAP series single-sided polishing equipment to enrich the product line
Able to meet diversified market demands

2020

Accelerate equipment R&D & expand the business comprehensively

Established the TSD Semiconductor Company with a focus on the semiconductor industry
Successfully launched TSP series single-sided polishing machine
IVG series grinder

2014-2020

Accumulate technology & build a product system

Independent research and development have been built up over 6 years，Established the three major product systems of thinning, polishing, and CMP