Put membrane back pressure on the wafer, polishing plate has built-in cooling system, swing arm dresser and friction & temperature detection endpoint monitoring function is optional
PC control system, touch screen control, manual loading, one-button automatic CMP polishing.
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4 or 6 inch polishing head, compatible with different sizes and types wafers.
Minimize the floor space of clean room.
|Specification / model||POLI-400L|
|Wafer size||Max 6 inch|
|Polishing plate size||Ø406mm（16inch）|
|Polishing plate rotation||30~200 RPM|
|Polishing head rotation||30~200 RPM|
|Wafer pressure||70~500g/cm2 membrane airbag flexible pressure|
|Reciprocating dressing system||Swing dressing system can be upgraded|
|Friction & temperature monitoring system||Optional, EPD function can add|
|Slurry supply system||Peristaltic pump, 3 independent pipes|