Multistage grinding program, waiting under overloading and other function, meeting various process requirements.
PC industrial computer system, touch screen control, one- button automatic grinding process in addition to manual loading and unloading.
Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials.
Ensure that process cost is reasonable and optimized.
|Wafer size||Max 6 inch|
|Grinding wheel size||Ø200(OD)mm|
|Grinding wheel rotation||0~3000 RPM|
|Operating table rotation||0~400 RPM|
|Z-axis Feed Speed||0.1~1000 um /sec Option: minimum 0.01um/sec|
|SECE/GEM, MES system||Optional|