Automatic thickness measurement and compensation, multistage grinding program, waiting under overloading and other function, meeting various process requirements.
Two grinding wheel shafts, no need to replace grinding wheels to realize rough and fine grinding.
PC industrial computer system, touch screen control, one- button automatic grinding process in addition to manual loading and unloading.
Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials.
|Wafer size||Max 8inch||Max 12inch|
|Grinding wheel shaft Qty.||2个||2个|
|Grinding wheel size||Ø203(OD)mm||Ø303(OD)mm|
|Grinding wheel rotation||0~6000 RPM||0~4000 RPM|
|Operating table rotation||0~400 RPM||0~260 RPM|
|Z-axis Feed Speed||0.1~1000 um /sec
|0.1~1000 um /sec
|On Line Thickness measurement resolution||0.1um||0.1um|
|On Line Thickness measurement repeatability||±0.001 mm||±0.001 mm|
|SECE/GEM, MES system||Optional||Optional|