POLI-500 is a small 8 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.
Put membrane back pressure on the wafer, polishing plate has built-in cooling system, swing arm dresser and friction & temperature detection endpoint monitoring function is optional.
PC control system, touch screen control, semiautomatic loading pallet is optional, one-button automatic CMP polishing.
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4, 6 & 8 inch polishing head, compatible with different sizes and types wafers.
Minimize the floor space of clean room.
| Specification / model | POLI-500 |
| Wafer size | Max 8 inch |
| Polishing plate size | Ø508mm（20inch） |
| Polishing plate rotation | 30~200 RPM |
| Polishing head rotation | 30~200 RPM |
| Wafer pressure | 70~500g/cm2 membrane airbag flexible pressure |
| Reciprocating dressing system | Swing dressing system can be upgraded |
| Friction & temperature monitoring system | Optional, EPD function can add |
| Semi-automatic loading pallet | Optional |
| Slurry supply system | Peristaltic pump,3 independent pipes |
86-10-6477 8430
Add：Building 6, No. 3, Duyang North Street, Shunyi District, Beijing 101300
Email：sales@tsd-semicon.com
Fax：86-10-6477 8420
