Put membrane back pressure on the wafer, polishing plate has built-in cooling system, swing arm dresser and friction & temperature detection endpoint monitoring function is optional
PC control system, touch screen control, manual loading, one-button automatic CMP polishing.
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4 or 6 inch polishing head, compatible with different sizes and types wafers.
Minimize the floor space of clean room.
Specification / model | POLI-400L |
Wafer size | Max 6 inch |
Polishing plate size | Ø406mm(16inch) |
Polishing plate rotation | 30~200 RPM |
Polishing head rotation | 30~200 RPM |
Wafer pressure | 70~500g/cm2 membrane airbag flexible pressure |
Reciprocating dressing system | Swing dressing system can be upgraded |
Friction & temperature monitoring system | Optional, EPD function can add |
Slurry supply system | Peristaltic pump, 3 independent pipes |