Full Automatic Grinding Machine

The full automatic grinding machine is a high-precision grinding machine equipped with fully automatic loading and unloading system, uses wafer manipulator to pick up the wafers, has automatic centering, cleaning and drying functions. It can realize automatic grinding process from cassette to cassette, and keep wafers dry in and out.

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Features

  • Complete function

    Automatic thickness measurement and compensation, multistage grinding program, waiting under overloading and other function, meeting various process requirements.

  • Abundant Specification

    Single or double axis grinding unit.

  • Fully automatic system

    Fully automatic loading and unloading, automatic grinding system to keep wafers dry in and out

  • Good compatibility

    Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials.

Performance Parameter

Item IVG-2040 IVG-2045 IVG-3040 IVG-3045
Wafer size Max 8 inch Max 8 inch Max 12 inch Max 12 inch
Grinding wheel shaft Qty. 1 2 1 2
Grinding wheel size Ø203(OD)m Ø203(OD)m Ø303(OD)m Ø303(OD)m
Grinding wheel rotation 0~6000 RPM 0~6000 RPM 0~4000 RPM 0~4000 RPM
Operating table rotation 0~400 RPM 0~400 RPM 0~260 RPM 0~260 RPM
Z-axis Stroke 130mm 130mm 130mm 130mm
Z-axis Feed Speed 0.1~1000 um /sec
Option: minimum
0.01um/sec
0.1~1000 um /sec
Option: minimum
0.01um/sec
0.1~1000 um /sec
Option: minimum
0.01um/sec
0.1~1000 um /sec
Option: minimum
0.01um/sec
On Line Thickness measurement resolution 0.1um 0.1um 0.1um 0.1um
On Line Thickness measurement repeatability ±0.001 mm ±0.001 mm ±0.001 mm ±0.001 mm
SECE/GEM, MES system Optional Optional Optional Optional

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