Automatic thickness measurement and compensation, multistage grinding program, waiting under overloading and other function, meeting various process requirements.
Single or double axis grinding unit.
Fully automatic loading and unloading, automatic grinding system to keep wafers dry in and out
Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials.
Item | IVG-2040 | IVG-2045 | IVG-3040 | IVG-3045 |
Wafer size | Max 8 inch | Max 8 inch | Max 12 inch | Max 12 inch |
Grinding wheel shaft Qty. | 1 | 2 | 1 | 2 |
Grinding wheel size | Ø203(OD)m | Ø203(OD)m | Ø303(OD)m | Ø303(OD)m |
Grinding wheel rotation | 0~6000 RPM | 0~6000 RPM | 0~4000 RPM | 0~4000 RPM |
Operating table rotation | 0~400 RPM | 0~400 RPM | 0~260 RPM | 0~260 RPM |
Z-axis Stroke | 130mm | 130mm | 130mm | 130mm |
Z-axis Feed Speed | 0.1~1000 um /sec Option: minimum 0.01um/sec |
0.1~1000 um /sec Option: minimum 0.01um/sec |
0.1~1000 um /sec Option: minimum 0.01um/sec |
0.1~1000 um /sec Option: minimum 0.01um/sec |
On Line Thickness measurement resolution | 0.1um | 0.1um | 0.1um | 0.1um |
On Line Thickness measurement repeatability | ±0.001 mm | ±0.001 mm | ±0.001 mm | ±0.001 mm |
SECE/GEM, MES system | Optional | Optional | Optional | Optional |