Product Center

Work together to create the future of the chips, committed to the continuous progress of grinding, polishing, and CMP technologies

Grinding

Polishing

CMP

Bonding/Cleaning/Brushing

TSP-380

This machine is an easy-to-operate desktop single side polishing machine. It can be matched with copper plate, tin plate, glass plate, stainless steel plate, etc., and with different types of polishing slurry, suitable for lapping and polishing various semiconductor materials, and meet the needs of R&D and small batch production of research institutes & enterprises.

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TSP-400/450

These series machines are floor-standing high-precision single side polishing machines. It can be matched with copper plate, tin plate, glass plate, stainless steel plate, etc., and with different types of polishing slurry, suitable for high-precision polishing of various semiconductor materials.

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TSP-810/910/1270

These series machines are high-precision, four-axis and single side polishing machines. It can be equipped with copper plate, tin plate, stainless steel plate, etc., suitable for high-precision polishing of various semiconductor materials to meet the needs of large-scale industrialization.

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TAP-400/600

These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, can polish one or multiple wafers and meet the high-precision polishing requirements of various materials.

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