Product application

Focus ceaselessly, specialized in the industry deeply, assist semiconductor substrate materials, semiconductor devices, advanced packaging, and MEMS industries to flourish.

Compound Semiconductor Substrate

Semiconductor Device

Advanced packaging

MEMS

With abundant compound semiconductor process experience and advanced machine manufacturing technology, TSD can provide grinding, lapping, polishing, waxing, cleaning machines and process solutions for various semiconductor substrate materials.

SiC

GaN

GaAs

InP

AlN

Ga2O3

GaSb

Diamond


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